On the examination of prototyping of key electromagnetic components for vacuum microelectronic devices by vat photopolymerization and magnetron sputtering
Ivan S. Ozhogin,1 Ilya O. Kozhevnikov,1 Alexey A. Serdobintsev,1 Andrey V. Starodubov,2 Nikita M. Ryskin,1,2 1 Saratov State University Saratov, Russia 2 Saratov Branch, V.A. Kotel’nikov Institute of Radio Engineering and Electronics RAS Saratov, Russia
Abstract
Nowadays, vacuum microelectronic devices remain the essential sources of high-power, wideband millimeter- and submillimeter-wave (THz) radiation. Undoubtedly, sub-THz and THz frequency bands will be extensively used in forthcoming novel telecommunication and wireless data transfer systems. In addition, electromagnetic waves in these frequency bands possess such attributes as the ability to permeate non-metallic materials like concrete, semiconductors, textiles, and plastics, which is crucial for the applications of non-destructive evaluation. Moreover, the THz domain reveals distinctive spectral features of diverse materials like semiconductors, ferroelectrics, dielectrics, high-temperature superconductors, gases, and liquids, showing promise in spectroscopy applications.
At the same time, the fabrication of key micro-sized components of THz-band vacuum microelectronic devices is fairly challenging. Several technological approaches for manufacturing submillimeter-sized components have been proposed to date, including lithography-based methods, deep reactive ion etching (DRIE), computer numerical control (CNC) micromilling, as well as additive manufacturing technologies. The benefits of additive technologies lie in significantly reducing the time and resources required for manufacturing fully functional prototypes. One of the most advanced, precise, and flexible 3D printing methods is based on stereolithography, specifically digital light processing (DLP) stereolithography.
In this paper, an approach to prototyping essential components of vacuum microelectronics devices is considered. This approach involves utilizing DLP 3D printing and the subsequent metallization of fabricated samples by magnetron sputtering. To examine the method, a straight waveguide section for operation in the V-band (50–75 GHz) was initially fabricated. The results concerning the morphology studies of the fabricated waveguide section, as well as the outcomes of investigations of reflection and transition losses, along with a comparison to a reference waveguide section made of metal, will be presented at the conference.
This work was supported by the Russian Science Foundation (project No. 22-49-02017).
Speaker
Ivan S. Ozhogin
Saratov State University
Russia
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