Features of laser microtreatment with nanosecond pulses of thin copper films of different thicknesses on solid dielectric substrates.
I. O. Kozhevnikov, 1, A. A. Serdobintsev, 1, V. V. Galushka, 1, A.V. Starodubov, 1,2
1 Saratov State University, Saratov, Russia
2 Saratov Branch of the V. A. Kotelnikov Institute of Radio Engineering and Electronics of the Russian Academy of Sciences, Saratov, Russia
Abstract
In recent decades, there has been a steady trend towards the miniaturization of radio-electronic devices, devices, as well as their components. In other words, the basic components of electronic devices are reduced in size, weight and other parameters. When miniaturizing the basic components of radio-electronic devices, a number of problems arise, one of which is to find an efficient and scalable approach to manufacturing miniaturized components. One of the possible approaches to the manufacture of miniature radio-electronic components can be approaches based on pulsed laser ablation. In this paper, the effect of the linear energy density of pulsed laser radiation of nanosecond duration on the ablation efficiency of thin copper films of different thicknesses deposited on solid dielectric substrates is investigated. The boundary values of the linear energy density of pulsed laser radiation have been established, which make it possible to completely remove a copper coating of a certain thickness. The obtained results will be used in the formation of micro-dimensional electrodynamic structures for use in vacuum microelectronics devices of the millimeter wavelength range.
Speaker
Rasulov Ilya
Saratov State University
Russia
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