Development of the creating diffractive optical elements with a large depth of plasma-chemical etching method for the infrared wavelength range
S.A. Fomchenkov
Image Processing Systems Institute – branch of the Federal Scientific Research Centre
“Crystallography and Photonics” of Russian Academy of Sciences,
Molodogvardejskaya street 151, Samara, Russia, 443001
Abstract
A modified plasma chemical etching method was proposed and researched. The method is based on using a dioxide layers as a hard mask for plasma etching. An experimental study was carried out on the manufacturing of an infrared lens with using of titanium dioxide as a hard mask. Main result of the proposed method and way of manufacturing is etching depth increasing with saving of same linear resolution in compare with typical chromium hard mask.
Speaker
Sergey Fomchenkov
Image Processing Systems Institute – branch of the Federal Scientific Research Centre “Cristallography and Photonics” of Russian Academy of Sciences
Russia
Discussion
Ask question
