Study the ablation regimes of thin copper films on dielectric substrates by nanoseconds laser pulses
In recent decades, there has been a steady trend towards miniaturization of electronic devices, and their key components. Fabrication of such microsized devices and their key part is a real challenge. One of the well-known methods of microfabrication is laser ablation. In this work, we study the peculiarities of influence of nanosecond laser pulses on thin copper films on dielectric substrates. The main aim of this work is to reveal the effective regime of nanosecond ablation of the copper thin film with different thicknesses. The deposition of a copper thin film on the dielectric substrate was carried out by magnetron sputtering. Glass slides were used as dielectric substrates. Several values of the thickness from 1 micron to 12 microns of the copper film were obtained. In order to quantitatively describe the interaction of a thin copper film with laser pulses of nanoseconds duration, the power density was calculated. The threshold of power density that needs to effectively ablate the rectangular region of the copper film with a certain thickness was revealed. The obtained results will be used in the future to microfabricate planar electromagnetic structures for vacuum electron devices operating in millimeter-wave bands.
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Saratov State University
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Why did you choose the laser ablation method for scientific research, what is its advantage over other methods?
This is a fairly simple, fast and direct way to synthesize micro - and nanostructures. It makes it possible to obtain micro - and nanostructures of various types, including metal, semiconductor and polymer. Laser ablation is also used for fine technical surface treatment. This method of synthesizing micro - and nanostructures can be used for laser drilling, pulsed lasers can drill very small, deep holes through very hard materials.
The advantages of this method include
• rapid heating and cooling of the processed material, which ensures the formation of metastable (a state whose stability is maintained under not very large perturbations) phases;
• strict dosage of material feed, including multi-component materials with high evaporation temperature;
• ability to process materials at small scales
• high processing speed