Concerning the potential of 3D printing technologies for microfabrication of next-generation communication system components
Kristina Chernozubkina1, Andrey Starodubov1,2, Nikita Ryskin1,2, 1 Saratov State University, Saratov, Russia, 2 Saratov Branch, Institute of Radio Engineering and Electronics RAS, Saratov, Russia
Abstract
The report discusses various additive 3D-printing technologies suitable for the fabrication of microsized key components of millimeter- and THz-band vacuum electron devices. Several categories of additive manufacturing processes have been identified and established. Here we will consider three types of additive manufacturing processes: material extrusion, vat polymerisation, and powder bed fusion. We will review and describe the following additive technologies: FDM/FFF (fused deposition modeling/fused filament fabrication), SLA (stereolithography), SLS/SLM (selective laser sintering/selective laser melting). The primary advantages and drawbacks of the aforementioned additive techniques for fabricating microsized essential components of millimeter- and THz-band vacuum electron devices will be highlighted. This work was supported by Russian Science Foundation under grant № 22-12-00181.
Speaker
Chernozubkina Kristina
Saratov State University
Russia
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